Silver plating is another electrodeposit process for electrical engineering, electronic and decorative applications. Our silver plating thickness is a minimum of 500 micro inches unless specified. Matte, Semi-bright and bright finishes are available as well as a chromate tarnish resisting treatment. Unlike gold plating, silver plating tends to oxidize much easier. For less rigorous electronics applications, silver plating is often used as a less expensive alternative to gold plating.

Silver electroplating :

  • White mate to very bright finish
  • Good corrosion resistance (depending on base metal)
  • Will tarnish easily
  • Hardness varies from 90 to 135 Brinnel
  • Excellent solderability (decreases with time)
  • Good lubricity and smear characteristics
  • Used as anti-galling on static seals, bushing, etc.
  • EXCELLENT electrical conductor

Argent

ASTM B700-97

  Silver plating thickness as per specify on drawing or by customer
   
Type I 99.9% min
Type II 99.0% min
Type III 98.0% min
Grade A Mat – Electrodeposits without luster, obtained from electroplating solutions operated without the use of brighteners
Grade B Bright – Electrodeposits obtained by the use of brighteners in the electroplating bath.
Grade C Bright – Electrodeposits obtained by mechanical or chemical polishing of Grade A silver coatings
Grade D Semi bright – Electrodeposit obtained by the use of addition agents in the electroplating bath.
Class N A finish that has had no supplementary tarnish resistant (that is chromate) treatment
Class S A – Finish that has had a supplementary tarnish resistant (that is, chromate) treatment.